The semiconductor industry talks endlessly about AI accelerators, chiplets and advanced nodes. But there’s a quieter challenge that determines whether ambitious chip designs actually make it to silicon: finding competent physical design engineers you can trust.
After 15 years as a contractor working across the industry, Tarun founded Next Gen Chip Design three years ago to address a recurring pattern. Former clients kept reaching out, not just seeking technical competence but the trust and track record they remembered from previous RTL-to-GDSII engagements. The constraint was obvious: there was only one Tarun. The solution became Next Gen—a way to scale that hands-on expertise whilst maintaining the accountability clients valued.
What sets specialist partners apart
Next Gen’s model is straightforward: Tarun acts as hands-on project lead for every engagement, supported by a team of physical design engineers. Without the infrastructure overhead of larger, more established competitors, the company offers competitive rates whilst maintaining close, personable service. The approach has resonated particularly well with startups and physical design teams within larger semiconductor companies—organisations that need proven expertise without the overhead of traditional consulting structures.
Physical design work is inherently cyclical. Peak place-and-route periods are followed by quieter RTL development phases. When schedules start to slip due to unexpected challenges—resource issues, technical complexity that exceeds initial estimates—specialist partners provide flexible capacity without permanent headcount commitments.
Recent projects have ranged from DDR subsystems for space applications (where precision timing and first-time-right silicon aren’t optional) to supporting clients across multiple technology nodes and market segments. The technical demands vary, but the pattern remains consistent: clients need competent engineers who understand the complete physical implementation flow and can deliver results without drama.
Quality at scale
With talent shortages forcing the industry to rethink how specialized expertise gets deployed, Next Gen’s approach centres on structured flexibility. Every project begins with collaborative assessment, followed by assembling a suitably competent team—often an optimal mix of senior and mid-level engineers. Personal oversight from Tarun across all engagements maintains accountability whilst leveraging the scalability that a growing team provides.
Being UK-based with experience working across the UK, Europe, Israel and the US gives Next Gen a global perspective that benefits client objectives—both technical and commercial.
In an industry facing talent constraints and increasingly complex designs, competent physical design expertise delivered with trust and accountability still matters. That’s the gap Next Gen was founded to address.
Next Gen Chip Design provides RTL-to-GDSII physical design services for semiconductor companies and startups developing high-performance ASICs and SoCs.